Design And Reuse, The System-On-Chip Design Resource - IP, …
Design And Reuse, The Web's System On Chip Design Resource : catalogs of IPs, Virtual Components, Cores for designing System-on-Chip (SOC)
Early Interactive Short Isolation for Faster SoC Verification
By Ritu Walia, Siemens (December 4, 2024) In modern semiconductor design, shrinking technology nodes and increasing circuit complexity make layout versus schematic (LVS) verification more challenging.
Alphawave IP - Announcement regarding leadership transition
LONDON, United Kingdom and TORONTO, Ontario, Canada -- December 5, 2024 – Alphawave IP Group plc (LSE: AWE, the “Company” or “Alphawave Semi”) today announces that John Lofton Holt has informed the Board of his intention to retire from the Company for personal reasons.. Mr. Holt will step down as Executive Chair and as an Executive Director of the Board effective as of 6 December 2024.
IP players prominent in chiplet's 2024 diary - design-reuse.com
While large semiconductor outfits like AMD and Intel were initially prominent in the chiplets world, IP players are now increasingly visible in showcasing the potential of chiplets. That includes established IP players like Arm and Cadence as well as upstarts such as Alphawave Semi.
Now Gelsinger is gone, what is Intel's Plan B?
By Peter Clarke, EETimes Europe (December 2, 2024) What is Intel going to do next? Do key decisions have to wait while the company finds a CEO to replace Pat Gelsinger, and where will it find a buyer for Intel Foundry if that is what investors are demanding?
HDMI 2.1 Tx PHY in TSMC (16nm, 12nm, N7, N6, N4, N3E)
The Synopsys HDMI 2.1 TX Controller and PHY IP solutions,compliant with the High-Definition Multimedia Interface (HDMI) 2.1 specification, provide the necessary logic to implement and verify designs for various HDMI-based applications. The IP provides quality digital video and audio transmission with up to 48Gbps aggregate bandwidth for …
Bounds in Placement - Design And Reuse
A placement bound is a constraint that controls the placement of groups of leaf cells and hierarchical cells. It allows us to group the cells and minimize the wire length. It helps us to place the cells at the most appropriate location.
Advanced Packaging and Chiplets Can Be for Everyone
The chiplet revolution is upon us. What began in laboratories as multi-die science projects has eventually evolved. A giant company like AMD, Intel or Nvidia can produce—either at TSMC or, in Intel’s case, internally—a giant, startlingly expensive CPU or GPU multi-die assembly using advanced packaging to achieve remarkable density, power efficiency and performance.
D&R Silicon IP Catalog: Directory of Semiconductor IP - Design …
D&R provides the world's largest directory of Silicon IP (Intellectual Property), SoC Configurable Design Platforms and SOPC Products from 400 vendors
Advancing Die-to-Die Connectivity: The Next-Generation UCIe IP …
Oct 21, 2024 · In today’s evolving AI/ML and HPC/datacenter landscapes, die-to-die connectivity is essential for achieving high-performance and efficient data transfer. ...